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Failure Mechanism Of Damp Heat Steady State Test

Test parameters

Main influence

Typical failure results

High relative humidity

Moisture absorption or adsorption; expansion; mechanical strength reduction; chemical reaction; corrosion; electrical corrosion; the conductivity of the insulator increases.

Physical damage, insulation failure, mechanical failure.

Low relative humidity

Drying; embrittlement; reduced mechanical strength; shrinkage; increased wear between moving contacts.

Mechanical failure, cracking.


Damp Heat Storage

The damp heat steady state test is primarily intended for component type specimens, to determine, in an accelerated manner, the resistance of specimens to the deteriorative effects of high temperature/humidity and cold conditions. The advantages of this method are its rapidity of application and that it utilizes convection heating; it therefore minimizes degradation due to radiation from heated surfaces. This test method of Third-party testing is not intended for the determination of long-term degradation under humid environments (at least not until the specimen shows signs of decomposition).


Damp Heat Test Standard 

IEC 60068-2-78: Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state

GB/T 2423.4: Environmental testing for electric and electronic products - Part 2: Test methods - Test Db: Damp heat, cyclic (12 h + 12 h cycle)

IEC 60068-2-30: Environmental testing - Part 2-30: Tests - Test Db and guidance: Damp heat, cyclic (12 h + 12 h cycle)

GB/T 2423.50: Environmental testing for electric and electronic products - Part 2: Test methods - Test Z/AD: Damp heat (steady-state)

IEC 60068-2-67: Environmental testing - Part 2-67: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)

GB/T 2423.40: Environmental testing for electric and electronic products - Part 2: Test methods - Test Dd: Damp heat, cyclic (12 h + 12 h cycle)

IEC 60068-2-66: Environmental testing - Part 2-66: Tests - Test Db and guidance: Damp heat, cyclic (12 h + 12 h cycle)

MIL-STD-810H: Test Method Standard for Environmental Engineering Considerations and Laboratory Tests - Method 507.6: Damp heat

MIL-STD-883K: Test Method Standard for Microcircuits - Method 1011.13: Damp heat (steady-state)

MIL-STD-202G: Test Method Standard - Electronic and Electrical Component Parts - Method 103: Moisture resistance (damp heat)

GJB 150A: Environmental Test Methods for Military Equipment - Part A: Damp heat test

GJB 360B: Environmental Test Methods for Military Equipment - Part B: Damp heat test

GJB 548B: Environmental Test Methods for Military Equipment - Part B: Damp heat test

GB/T 28046.4: Road Vehicles - Environmental Conditions and Testing for Electrical and Electronic Equipment - Part 4: Damp heat test

ISO 16750-4: Road Vehicles - Environmental Conditions and Testing for Electrical and Electronic Equipment - Part 4: Damp heat, steady state

YD/T 2379: Technical Requirements and Test Methods for Telecommunications Equipment - Part 4: Damp heat test

ETSI 300 019-2: Environmental Engineering (EE) - Environmental Conditions and Environmental Tests for Telecommunications Equipment - Part 2: Damp heat

GR-63: Generic Requirements for Network Telecommunications Cabinets, Electrical, and Environmental: Damp heat

GR-487: Generic Requirements for Telecommunications Data Center Equipment and Spaces: Damp heat


These standards outline the test methods and procedures for evaluating the performance and reliability of products under damp heat conditions.


Test Capability of ORT Damp Heat Steady State Test

Test Capability of ORT Damp Heat Steady State Test

Damp heat test capability parameters: 10℃~98℃@10%RH~98%RH

Constant heat and humidity (unsaturated high pressure steam) capacity parameters:

Air pressure range: 0.1~0.296Mpa

Temperature range: ≤150℃

Humidity range: 75%RH~100%RH


What Is Damp Heat Test

The damp heat test is a type of environmental stress test used to evaluate the resistance of materials and products to humidity and high temperatures. This test is commonly used in the TIC (Testing, Inspection, and Certification) industry to assess the quality and reliability of electronic components, PCBs (Printed Circuit Boards), and other devices that are exposed to high humidity and temperature conditions.


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